HTS-300
HTS-300
FEATURES

◎ Lowest processing consumption at 150 cc

◎ High temperature processing at a maximum of 240°C
◎ 
W/F reverse processing preventing fume diffusion
◎ 
Strip processing performed in as little as 30 seconds

Two-layer structure with four SPM chambers and four cleaning chambers

SSD Series 3000/2000
SSD Series 3000/2000
FEATURES

◎ Greater Diversity of Chamber Configuration

     √ Single Decker (SS Type)

     √ 4 Chambers

     √ 8 Chambers

◎ Smaller footprint

◎ Double Decker (SSD Type)

     √ 8 Chambers

     √ 12 Chambers 

BW Series 3700
BW Series 3700
FEATURES

Reduced footprint (10%)

Stable processing achieved through the elimination of BATH disparity caused by individual piping in the exhaust system

Simplified piping arrangement

Wafer contact point size reduction

Reduced bubble generation

Improved liquid replacement efficiency through the introduction of a reverse flow system

Improved concentration stability

Greater bath compatibility

Supports one chemical + one DIW configurations

BW Series 3000/2000
BW Series 3000/2000
FEATURES

◎ Increased throughput

◎ Selection of high speed LD/ULD (I-Type) (up to 500 WPH with 300mm wafers)

◎ Smaller footprint

◎ Reduced CoO

◎ Air flow control

◎ Complete standardization (stabilized performance, reduced set-up time)

◎ SEMI standard

◎ SECS/GEM compliant

◎ EES (EDA or TDI) compliant 

SC Series
SC Series
FEATURES

◎ High throughput

◎ Process time throughput

◎ Front side 450 WPH

◎ Both sides 225 WPH

◎ Small footprint

◎ Double decker system

◎ Wafer cleaning method

◎ Brush type

◎ SN spray

Bevel Treatment LIBRA
Bevel Treatment LIBRA
FEATURES

◎ Local cleaning with original chemical jet nozzle

◎ No Purge N2

◎ Damage-free

◎ No cover DIW

◎ Watermark-free 

Dryer MMDS
Dryer MMDS
FEATURES

◎ Two Types of IPA Mist Generation Systems

     1. Injection System 

          IPA concentration control

          Independent adjustable IPA flow rate and N2 flow rate

 

     2. Budding System 

          Selectable N2 gas temperature (hot and cool)

          Switchable high and low consentration

 

◎ Two Types of IPA Mist Jet Systems

     1. Indirect Jet System 

          Uniformed IPA consentration in the drying chamber

          Decreased drying tyme by 250-300 seconds (including transfer time)

 

     2. Direct Jet System 

          IPA mist jet system from the upper part in the chamber

          Switchable high and low consentration

 

◎ Continuous process in oxygen-free conditions 

◎ RD mode (DIW) rinse-dry

◎ FRD mode DHF- (DIW) rinse-dry

◎ Uniformity: oxide etch uniformity

◎ 30ű4% (FMMDS mode only)

◎ 45nm compatibility 

QUANTUM Series
QUANTUM Series
FEATURES

◎ Meets the process needs of the semiconductor industry, and many other industries.

◎ The module units are combined, allowing for quick delivery and performance unity.

◎ There is an abundance of options which will allow the user to obtain the desired functions.

◎ The module size can be adjusted from its regular dimensions.

◎ Easy to operate. 

VRC Series VRC310S/VRC200S
VRC Series VRC310S/VRC200S
FEATURES

◎ Clean unit installed.

◎ The droplet measuring is accurate (±10%).

◎ The droplet collection is efficient (over 90%).

◎ The maximum amount of the droplet is 200μl (depending on the liquid composition).

◎ The collecting performance level is 10atons/cm2 (for 8-inch wafers), from AAS analysis (depending on the liquid composition).

◎ Scanning is available for any intended range by changing the mode setting.

◎ A retainer will be used for each wafer, to prevent cross-contamination.

◎ Contains CE mark. 

Quarts Tube Wet
Quarts Tube Wet
FEATURES

 ◎ Custom Made, Low Cost 

Manual Wet Station
Manual Wet Station
FEATURES

 ◎ Custom Made, Low Cost 

 

Spin Dryer
Spin Dryer
FEATURES

◎ Custom Made, Low Cost

      √ Automated Spin Dryer

      √ Spin Dryer

Quarts Tube Storage
Quarts Tube Storage
FEATURES

◎ Custom Made, Low Cost